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Walter Goodwin says these AI chips use advanced packaging with TSMC.

Walter Goodwin · Frontier Chips for Frontier AI Labs, with Walter Goodwin, Founder/CEO of Fractile · 2 Oct 2026

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“advanced packaging with TSMC. And so I think one of the things that we see in the landscape is there's a relative dearth still of kind of efforts that go all the way up and down the silicon stack and try and build kind of fundamentally new capabilities.”

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