causal claim
Hybrid bonding is only now entering volume manufacturing because its alignment and defect challenges took time to resolve.
Dwarkesh Patel · What will computer chips look like in 2045? · 22 Oct 2026
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“This process makes the insulating surfaces around the copper bond as well. And so by removing the solder bumps, you end up with much denser connections. But the reason this technology is only now entering volume manufacturing is because it took a while to iron out the alignment and defect challenges that it introduced.”42:01Report a misattribution
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