definition claim
Interposer-based chip packaging is often called 2.5D packaging.
Dwarkesh Patel · What will computer chips look like in 2045? · 22 Oct 2026
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“This type of packaging is often called 2.5D. Another way to increase connection density is to bond chips directly to one another. This allows for shorter connections between chips, but the early versions of this idea use solder bumps, which are bulky and increase resistance.”41:22Report a misattribution
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