descriptive claim
Researchers are considering wafer-to-wafer bonding for memory stacking and other proposed applications.
Unresolved speaker · What will computer chips look like in 2045? · 22 Oct 2026
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“Um, that's an approach that's really popular right now in the CMOS image sensor industry, and in fact, basically dominates it. Um, and it's being looked at for other things like memory stacking, all kinds of stuff people have published ideas about.”44:12Report a misattribution
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