Because TSMC lacks backside power, it must use tighter pitches that cannot be printed with High-NA, requiring double-patterning EUV and making High-NA not very helpful for TSMC.

“TSMC has to run very m- tighter pitches because they don't have backside power, and they can't do that with High-NA, so they have to use double patterning EUV. So for them, it's not very helpful.”