prediction claim

The speaker expects their organization to use both wafer-level and chip-level hybrid bonding, with the choice driven by customer needs and architecture; chip-level bonding is especially suitable for logic-to-logic applications.

Unresolved speaker · What will computer chips look like in 2045? · 22 Oct 2026

In their words

The transcript segments this claim was taken from

“I think we're gonna do both. We definitely have the capability to do both. It's really customer and architecture-driven, but certainly chipped wafer in the logic-to-logic space makes a lot of sense.”

45:19 Report a misattribution

0.90how strongly it was put, not whether it is true

0.75importance to the conversation

0.96confidence the claim was read correctly