prediction claim
The speaker suggests that hybrid bonding could eventually join reduced interconnect layers on both sides and reduce total IR drop between two transistor layers.
Unresolved speaker · What will computer chips look like in 2045? · 22 Oct 2026
In their words
The transcript segments this claim was taken from
“That's really kinda where the beauty of hybrid bonding happens. You can think someday about even having reduced interconnect layers on both sides that we can bond together and have less total, you know, IR drop between the two transistor layers.”46:46Report a misattribution
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