descriptive claim
The 0.45-micrometer hybrid-bonding pitch represents roughly another order of magnitude in density compared with current HVI, and its scalability has already been demonstrated.
Unresolved speaker · What will computer chips look like in 2045? · 22 Oct 2026
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“So you can imagine that's a whole another order of magnitude and density, again, from where we are right now on HVI-”
“... and scalability that's already been proven. So I see a long runway there.”46:07Report a misattribution
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