Hybrid bonding can provide high raw interconnect density in non-AI applications, especially between components such as a CPU and GPU.

“Ah, excellent question. So there are companies out there that are looking at it for non-AI applications, even in fact, in, uh, client devices, right? And one of the big things I think that that can help with there is, well, number one, obviously the same raw interconnect density, especially between something like a CPU and a GPU.”