descriptive claim
A paper presented at the IEEE ECTC conference in the year of the conversation reported reliability data for a hybrid-bonded device with a 0.45-micrometer pitch.
Unresolved speaker · What will computer chips look like in 2045? · 22 Oct 2026
In their words
The transcript segments this claim was taken from
“In fact, the biggest conference every year in packaging is the IEEE ECTC conference that happens in May. And there was a paper there this year showing, uh, reliability data on a zero point four five micron pitch hybrid bonded device.”45:52Report a misattribution
0.95how strongly it was put, not whether it is true
0.65importance to the conversation
0.98confidence the claim was read correctly